Tan Yeow Meng,: search on Z-Library

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1

Fault isolation in semiconductor product, process, physical and package failure analysis: Importance and overview

Jiann Min Chin, Vinod Narang, Xiaole Zhao, Meng Yeow Tay, Angeline Phoa, Venkat Ravikumar, Lwin Hnin Ei, Soon Huat Lim, Chea Wei Teo, Syahirah Zulkifli, Mei Chyn Ong, Ming Chuan Tan

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 2.48 MB

english, 2011

2

[IEEE 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, China (2013.07.15-2013.07.19)] Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Recent advances in fault isolation for semiconductor industry

Chin, Jiann Min, Narang, Vinod, Tay, Meng Yeow, Shei Lay Phoa,, Venkat, Ravikumar, Ei, Lwin Hnin, Lim, Soon Huat, Teo, Chea Wei, Zulkifli, Syahirah, Qiu, Wen, Tan, Joseph, Ranganathan, Gopi, Zi Ying

Year:

2013

Language:

english

File:

PDF, 4.00 MB

english, 2013

3

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Thermal Simulation and Experimental Validation for TEC Design

Shi, Peter, Wong, Stephen, Tan, Yeow Meng, Sunappan, Vasudivan, Fan, Wei, Chua, Kai Meng, Freeman, Bill, Jiang, Hongjin

Year:

2005

Language:

english

File:

PDF, 379 KB

english, 2005

4

Impact of Packaging Design on Reliability of Large Die Cu/Low- (BD) Interconnect

Chai, T.C., Zhang, X., Li, H.Y., Sekhar, V.N., Khan, O.K.N., Lau, J., Murthy, R., Yeow Meng Tan, Cheng, C.K., Siao Li Liew, Dongzhi Chi

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 1.54 MB

english, 2012

5

Serum Levels of Brain-Derived Neurotrophic Factor and Insulin-Like Growth Factor 1 Are Associated With Autonomic Dysfunction and Impaired Cerebral Autoregulation in Patients With Epilepsy

Chen, Shu-Fang, Jou, Shuo-Bin, Chen, Nai-Ching, Chuang, Hung-Yi, Huang, Chi-Ren, Tsai, Meng-Han, Tan, Teng-Yeow, Tsai, Wan-Chen, Chang, Chiung-Chih, Chuang, Yao-Chung

Journal:

Frontiers in Neurology

Year:

2018

Language:

english

File:

PDF, 373 KB

english, 2018

6

Investigation of weight-on-wheel switch failure in F-16 aircraft

Cher Ming Tan, Kok Meng Ang, Liang Huat Tay, Tan Yeow Meng

Journal:

Engineering Failure Analysis

Year:

2005

Language:

english

File:

PDF, 950 KB

english, 2005

7

[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - Digital Image Correlation and its Applications in Electronics Packaging

Sun Yaofeng,, Tan Yeow Meng,, Pang, J.H.L., Su Fei,

Year:

2005

Language:

english

File:

PDF, 3.25 MB

english, 2005

8

Awareness on Sustainable Affordable Housing Among Homebuyers in Malaysia

Ang, Salem, Olanrewaju, Abdul Lateef, Chia, Fah Choy, Tan, Yeow Seong, Zainorizuan, M.J., Yee Yong, L., Alvin John Meng Siang, L., Mohamad Hanifi, O., Siti Nazahiyah, R., Mohd Shalahuddin, A.

Journal:

MATEC Web of Conferences

Year:

2017

Language:

english

File:

PDF, 128 KB

english, 2017

9

An Investigation Into Design Criteria for Affordable Housing Supply

Olanrewaju, Abdul Lateef, Lee, Lim Tat, Seong, Yeow Tan, Mine, Naoto, Teng, Chai Teoh, Zainorizuan, M.J., Yee Yong, L., Alvin John Meng Siang, L., Mohamad Hanifi, O., Siti Nazahiyah, R., Mohd Shalahud

Journal:

MATEC Web of Conferences

Year:

2017

Language:

english

File:

PDF, 464 KB

english, 2017

10

Strongly regular graphs constructed fromp-ary bent functions

Yeow Meng Chee, Yin Tan, Xian De Zhang

Journal:

Journal of Algebraic Combinatorics

Year:

2011

Language:

english

File:

PDF, 594 KB

english, 2011

11

[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Assembly Challenges of High Density Large Fine Pitch Lead-Free, Flip-Chip Package

Ser Choong Chong,, Yeow Meng Tan,, Tai Chong Chai,, Samuel Lim,, Wai Yin Hnin,, Chek Kweng Cheng,

Year:

2006

Language:

english

File:

PDF, 2.27 MB

english, 2006

12

Prevalence of Visual Disorders in Chinese Schoolchildren

CHUNG, KAH MENG, MOHIDIN, NORHANI, TEE YEOW, PENG, TAN, LI LI, O???LEARY, DANIEL

Journal:

Optometry and Vision Science

Year:

1996

File:

PDF, 464 KB

1996

13

Factors Associated With Increased Carotid Intima-Media Thickness in Obstructive Sleep Apnea/Hypopnea Syndrome

Tan, Teng-Yeow, Liou, Chia-Wei, Friedman, Michael, Lin, Hsin-Ching, Chang, Hsueh-Wen, Lin, Meng-Chih

Journal:

The Neurologist

Year:

2012

Language:

english

File:

PDF, 100 KB

english, 2012

14

Ytterbium trifluoromethanesulfonate [Yb(OTf)3] promoted indium mediated allylation reactions of carbonyl compounds in aqueous media

Ruibin Wang, Chong-Meng Lim, Choon-Hong Tan, Bee-Khim Lim, Keng-Yeow Sim, Teck-Peng Loh

Journal:

Tetrahedron: Asymmetry

Year:

1995

Language:

english

File:

PDF, 210 KB

english, 1995

15

[IEEE 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Reliability assessment of high density fine pitch lead-free flip chip package

Ser Choong Chong,, Simon Ting,, Tan Yeow Meng,, Chai Tai Chong,, Srinivasamurthy Sampath,, Hnin Wai Yin,, Lim, S., Cheng Chek Kweng,

Year:

2004

Language:

english

File:

PDF, 309 KB

english, 2004

16

Hardened Glass Particle and Carbon Black Using Resin for Potential Electromagnetic Shielding in Biomedical Electronic Equipments

Meng, Cheng Ee, Abdul Majid, Mohd Shukry, Bakar, Shahriman Abu, Mohd Nasir, Nashrul Fazli, Fhan, Khor Shing, Yeow, You Kok, Yee, Lee Kim, Mohd Jamir, Mohd Ridzuan, Hong, Tan Wei, Ridha Shaharuddin, Sh

Journal:

Journal of Physics Conference Series

Year:

2019

Language:

english

File:

PDF, 758 KB

english, 2019

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